Solder Paste RELIFE RL-223-OR (100 g)
RELIFE RL-223-OR is a lead free high quality solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.
|Net weight||100 g|
|Package Dimensions||65 × 75 × 60 mm|
- Solder Paste RELIFE RL-223-OR (100 g) — 1 pc.